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Die Attach Adhesive
Electrically & Thermally Conductive
Electrically Insulating & Thermally Conductive
 

 
 
Die Attach Adhesive (Electrically & Thermally Conductive)
 S/N   Part Number  Type  Specific Gravity  Viscosity  TI Index  Tg  Pot Life  Shelf Life Description  Specs 
                     
1 IMT-EE1009 Single or two Components 2.95 12,000cPs 4.36 > 100°C < 48 hours 1 year @ -40°C Snap cure die attach epoxy designed for small to medium die size. This product has low ionic contents & excellent electrical properties. It can be premixed in syringe for ease in use.
TDS

MSDS

2 IMT-EE1019 Single Component 2.66 15,000cPs 3.00 70°C 24 hours 1 year @ -40°C Fast cure die attach epoxy designed for small to medium die-size. This product has good adhesion to various lead frames, substrates & flex tape.
TDS

MSDS

3 IMT-EE1040 Single Component 3.04 7,000cPs 4.0 > 160°C > 48 hours 1 year @ -20°C Low temperature snap cure die attach silver epoxy. This product has high glass transition temperature and suitable for small to medium die size application. It has ultra low ionic contents.
TDS

MSDS

4 IMT-EE1040A5 Single Component 3.30 7,800cPs 4.38 167°C > 48 hours 1 year @ -20°C Higher modulus and TI index version of EE1040. This product is designed for LED die attach applications. The material rheology is well suited for dispensing as well as dotting or pin-transfer methods.
TDS

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5 IMT-EE1060T Two Components 2.70 9,400cPs 2.40 89°C > 4 hours 1 year @ RT Low to moderate temperature cure conductive die attach adhesive. This product is developed for microelectronics application that requires room temperature storage.
TDS

MSDS

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