Other Application Specific Adhesive is mainly for microelectronics application. This product category includes fiber-optic adhesive, SMT adhesive and B-Stage Adhesive. They are primarily single component version, sub-ambient temperature storage and elevated temperature cure.

For fiber-optic adhesive, we could prepare in two components version and bi-pak packaging option is available. For SMT adhesive, both high speed, automated syringe dispensing and screen printing method adhesives are available. For B-Stage adhesive, inorganic filler loaded and unfilled version are available.

For applications that we do not have an existing epoxy adhesive and material to offer, please share more details with us. We shall do our best to come up with a solution within your schedule.