Die Attach Adhesive is either silver or inorganic filler loaded epoxy adhesive for microelectronics application. They could be electrically & thermally conductive, electrically insulating & thermally conductive or both electrically & thermally insulating. Most of our products in this category are single component epoxy materials that require sub-ambient temperature storage and elevated temperature cure. We could offer certain grades of die attach adhesive in two components version for ease in handling and shipping.

Our cure profiles range from snap cure ( ≤ 2 mins), fast cure ( ≤ 30 mins) or standard cure ( 1 to 2 hours) at elevated temperature. We also have various grades that were designed for small, medium and large die size.

Over time, we have developed electrically conductive epoxy adhesive for non-microelectronics application, especially replacing silver flakes with silver coated copper flakes.