Microelectronics

Microelectronics

Microelectronics is a sub field of electronics and relates to the study and manufacture of very small electronic devices and components. These devices are typically made from semiconductor materials. Many components of  electronic design are available in a microelectronic equivalent. These include transistors, capacitors, inductors, resistors, , diodes and conductors can all be found in microelectronic devices.

Digital Integrated Circuit or IC consist of billions of transistors, resistors, diodes, and capacitors. These IC chip or die normally is attached onto lead frame or substrate using either conductive or non-conductive die attach adhesives.

To protect these IC chip or die as well as their interconnects (gold or aluminum wires), back-end IC packaging or assembly house would use liquid encapsulant or transfer molding technique to encapsulate their IC packages.

Product Line-up

DIE ATTACH ADHESIVES

# Electrically Conductive #

IMT-EE1019 Series (Standard)

IMT-EE1009, EE1009-2K (Snap Cure)

IMT-EE1040, EE1040A5 (High Tg)

IMT-EE1040SS, EE1040L (Low Stress, Flexible)

IMT-EE1070 Series (Low Cost; Ag Coated Cu)

# Thermally Conductive #

IMT-TE1009, TE1009-2K (Snap/Fast Cure)

IMT-TE1040 Series (Low Temp Snap Cure)

IMT-CE06-DA BLK (High Tg)

LIQUID ENCAPSULANT

# Globtop #

IMT-CE06-TM3 (Gloss Black, Standard)

IMT-CE06-3LV BLK (Matt Black, Low Vis.)

IMT-CE06-SF3 (Gloss Black, Low Vis.)

IMT-CE06-3WB BLK (Ultra-Gloss Black)

IMT-CE06-SF4 (Semi-Gloss Black,

 High Adhesion)

# Dam / Fill #

IMT-CE06-3 BLK (Dam, Matt)

IMT-CE06-3WB-HV BLK (Dam, Gloss)

IMT-CE06-3LV BLK (Fill, Matt)

IMT-CE06-3WB-LV (Fill, Gloss)

OTHER APPLICATIONS

# Fiber Optics Adhesive #

IMT-CE03-3 (1K)

IMT-CE33-2K (2K)

# SMT Adhesive #

IMT-SA109 (Screen-printing)

IMT-SA110-2 (Dispensing)

IMT-SA110-6 (Screen-printing)

# B-Stage Adhesive #

IMT-TE1100B (ThK)

IMT-TE1100B-UF (Non-Conductive)