Liquid Encapsulant for microelectronics application typically contains inorganic filler as well as without filler, depending on specific requirement. Therefore, they are either electrically insulating & thermally conductive for filled system or electrically & thermally insulating for unfilled system.  Globtop encapuslant epoxy, dam & fill encapsulant epoxy and potting epoxy are majors for this category..

Our globtop, dam & fill encapsulant epoxies are single component version, require sub-ambient temperature storage and elevated temperature cure.

Our potting epoxies could be either single or two components version. For single component version, sub-ambient temperature storage and elevated temperature cure are required. For two components version, room temperature storage and either room or elevated temperature cure are required.

Potting epoxies for electrical applications may require epoxy material to be a flame retardant plastic that meet UL94-HB, V2, V1 or V0 fire rating.